Low-fire high-permittivity dielectric compositions

ABSTRACT

A dielectric composition that can be fired at a temperature of below 900° C. The dielectric composition has a dielectric constant of 25–35 and a quality factor (Qxf) of 6,000–20,000 GHz. The composition comprises 3–16 wt % of K 2 O—Na 2 O—Li 2 O—B 2 O 3 —SiO 2  system glass frit and 84–97 wt % of BaO—TiO 2  system dielectric ceramics. The composition can be effectively applied to construct a part of a ceramic multi-layer packaging as a resonator form such as a filter or an antenna, etc.

CROSS REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. application Ser. No. 10/637,320, filed Aug. 7, 2003, now U.S. Pat. No. 7,087,545, by Jae-Hwan PARK, et. al., entitled LOW-FIRE HIGH PERMITTIVITY DIELECTRIC COMPOSITIONS, which claims the benefit of Republic of Korea Appln. S.N. 20799/2003 filed on Apr. 2, 2003, the contents of which are incorporated by this reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a dielectric composition which can be fired at a temperature of below 900° C. while having a high dielectric constant and quality factor, and more particularly, to a composition with a dielectric constant in the range of 20–40 and a quality factor (Qxf) of above 10,000 GHz. This type of composition can be effectively applied to constitution of a part of a ceramic multi-layer packaging as a type of resonator such as a filter or an antenna.

2. Description of the Background Art

Development of an information and telecommunication system and related parts is largely focused on the trend of high frequency, compactness and high performance.

Especially, in order to make parts compact, a passive integration technique is required to make a passive device one module, for which many researches and development are ongoing.

Various techniques have been invented to implement a multi-layer packaging by using a ceramic material having a low dielectric loss value at a microwave band. In most cases, however, in order to fire the ceramic material, a firing process is necessarily performed at a high temperature of above 1,300° C. Thus, in order to form a conductor line inside the ceramic packaging with a multi-layer stacked structure, precious metals such as Pt or W have been used. Those precious metals, however, has problems that they are costly and have bad electrical properties because of a low electric conductivity.

Recently, a research is being actively conducted on a multi-layer ceramic packaging using the internal electrode such as Ag or Cu with an excellent electrical conductivity, instead of using the electrode such as Pt or W.

That is, a ceramic substrate with a low dielectric loss value and an AG/Cu electrode are stacked as a multi-layer and co-fired to obtain a high density three-dimensional line substrate with superior electrical properties. In such a case, in order to minimize a signal delay, preferably, the ceramic substrate has a low dielectric constant, and in order to minimize an electrical loss, the dielectric loss value is preferably small.

In addition, in order to co-fire it with the Ag electrode, the ceramic composition should have a firing temperature of below 900° C.

Relevant techniques mostly show a combination of B₂O₃—SiO₂ system glass frit and Al₂O₃ filler. In this case, the ceramic substrate usually has a dielectric constant in the range of 4–10.

The conventional techniques are directed to ceramic multi-layer packaging utilized only with a simple three-dimensional wiring substrate. Lately, however, as various types of passive parts are implemented inside the multi-layer ceramic packaging, advanced from the simple wiring substrate, a necessity of adding diverse functions to the packing emerges.

In particular, in order to implement a filter or an antenna in the resonator type inside the multi-layer ceramic packaging, a composition with a high dielectric constant is required. In order to control a distributed circuit element such as the filter or the antenna in the resonator type to a suitable size, a length of an effective wavelength needs to be reduced.

Currently, a microwave band is in the range of 1–300 GHz, and in this frequency range, a dielectric constant range required for obtaining a length of the most suitable effective wavelength for implementing a device is 20–100.

In addition, it is preferred that the quality factor (Qxf) has a value higher than 1,000 and a temperature coefficient of resonant frequency is below ±20 ppm/° C.

Dielectric compositions with a dielectric constant of 20–100 and excellent microwave properties are ZrO₂—SnO₂—TiO₂, MgTiO₃—CaTiO₃, BaO—La₂O₃—TiO₂, BaO—TiO₂ system.

These ceramics have a high quality factor at the microwave band (>5,000 GHz) but their firing temperature is mostly 1,300° C., high. Therefore, in order to make them a composition for packaging which can be fired together with the Ag/Cu electrode at below 900° C., a sintering additive should be added to lower the firing temperature.

U.S. Pat. No. 5,872,071 discloses lowering the sintering temperature to about 1,000° C. by adding a sintering additive in a form of BaCuO₂—CuO in the range of 0.1–50 wt % to a ZrO2—SnO₂—TiO₂ composition with a dielectric constant of about 40. In this case, a dielectric constant is 35–40 and a quality factor (Qxf) is 7,000–35,000 GHz at 7 GHz.

U.S. Pat. No. 5,616,528 presents an example that up to 10 wt % of glass frit in the form of B₂O₃—Li₂CO₃ is added to a MgTiO₃—CaTiO₃ dielectric, which is then fired at a temperature of 950° C. In this case, a dielectric constant is in the range of 19–24.

U.S. Pat. No. 5,994,253 presents an example that 5–15 wt % of ZnO—SiO₂—B₂O₃ system glass composition is added to a BaTiO₃—TiO₂ dielectric, which is then fired at a temperature of 900–940° C. In this case, a dielectric constant is between 60 and 90 and a value ‘Q’ is 1,000–1,500.

The above listed patent articles present the compositions which has the dielectric constant of 20–100 and can be fired at a low temperature, but their sintering temperature is about 900–1,000° C., which is high.

Though a melting temperature of Ag is 950° C., Ag is diffused into a neighboring dielectric at above 900° C., causing problems that the electrode is changed in its form and electric conductivity is degraded.

Therefore, in order to co-fire it with the Ag electrode, the firing temperature of the ceramics is preferred to be lowered down.

SUMMARY OF THE INVENTION

Therefore, an object of the present invention is to provide a high dielectric constant ceramics of which firing temperature is below 900° C. while having favorable electrical properties.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In order to fabricate a dielectric composition of the present invention, a high dielectric constant microwave ceramics is prepared, a glass frit composition for sintering the ceramic composition, which are then mixed and sintered at a low temperature.

First, BaO-nTiO₂ (n=4–4.5) composition was selected as a high dielectric composition. This composition is densificated at a temperature of above 1,350° C., and has a dielectric constant of about 38 and a quality factor (Qxf) of above 30,000 GHz.

Fabrication of Mother Material Dielectric Ceramics

The ceramic dielectric is fabricated by the following process. Powder was fabricated by using a mixed oxide method, a general solid state reaction. As a starting material, BaCO₃, TiO₂ general ceramic material powder was calculated to have a composition of BaO-nTiO₂ (n=4–4.5), weighed and ball-milled.

The ball-milled mixed powder was subjected to a calcining process in the air for 2–3 hours at the temperature of 1,000–2,000° C., to synthesize a phase of BaTi₄O₉ or Ba₂Ti₉O₂₀.

In the present invention, besides the BaO-nTiO₂ (n=4–4.5), other types of compositions similar to the BaO-nTiO₂ were considered. That is, as a dielectric composition with a dielectric constant of 80–90, a composition of (Ba,Pb)O—Nd₂O₃—TiO₂(BaO:PbO:Nd₂O₃:TiO₂=8.3:36.4:12.1:43.2 wt %) and a composition of Bao-(Bi,Nd)₂O₃—TiO₂(BaO:Bi₂O₃:Nd₂O₃:TiO₂=16.4:9.9:35.1:38.6 wt %) were considered for their low temperature sintering characteristics by a glass frit.

Its fabrication method is as follows.

Powder was prepared by using a mixed oxide method, a general solid state reaction.

First, BaCO₃, PbO, Bi₂O₃, Nd₂O₃, TiO2 general ceramic material powder was weighed down to four decimal places of effective numbers at a quantizing rate to make a composition, respectively, and ball-milled by using deionized water. The ball-milled mixed powder is calcined in the air for 2–3 hours at a temperature of 1,000–1,200° C. at a rising temperature rate of 300° C./h, to synthesize each phase.

Fabrication of Glass Frit

A BaO—TiO₂ system composition glass frit for a low temperature firing was synthesized. The glass composition having a low glass transition temperature (Tg) and low dielectric loss was fabricated through repeated preliminary experiments as suggested in below Table 1.

Each material powder was weighed with the weight rate of Table 1, dry-mixed, put it in a platinum furnace, maintained at a temperature of 1,300° C. for 2 hours, and the melted material was quenched at a water tub.

The thusly obtained glass was first preliminarily broken at an agate induction and secondarily pulverized together with a zirconia ball by using ethanol as a solvent in a polyethylene bottle for 24 hours, which was then undergone an attrition milling for 5 hours.

An electrical property of the obtained glass is as shown in Table 1

TABLE 1 Lithium boroslicate glass compositions and properties tanδ Composition (wt %) Density k (1 MHz) TEC Tg Ts No. Li₂O B₂O₃ SiO₂ K₂O Na₂O (g/cm³) (1 MHz) (%) α_((Tg)×10) ⁻⁷ (° C.) (° C.) F01 31.9 52.9 15.2 — — 2.28 7.71 0.30 153 403 422 F02 26.9 59.7 13.4 — — 2.28 7.21 0.40 131 443 464 F03 23.9 49.3 26.8 — — 2.32 6.88 0.35 119 464 491 F04 20.0 42.0 38.0 — — 2.34 6.44 0.36 105 488 513 F05 18.7 42.0 39.3 — — 2.33 6.29 0.34 101 503 524 F06 30.6 57.3 12.1 — — 2.27 7.58 0.51 144 412 433 F07 30.0 34.6 35.4 — — 2.37 7.51 0.54 129 433 464 F08 28.2 43.2 28.6 — — 2.34 7.33 0.59 125 450 480 F09 28.3 33.4 38.3 — — 2.37 7.35 0.54 126 438 469 F10 38.8 48.7 12.5 — — 2.25 8.35 0.75 146 371 389 F11 40.3 50.3 9.4 — — 2.23 8.47 0.46 150 359 377 F12 36.6 56.3 7.1 — — 2.23 8.15 0.80 146 379 398 F13 15.3 47.9 10.1 16.1 10.6 2.32 8.44 0.70 150 400 421 F14 21.6 50.7 10.7 17.0 — 2.31 8.11 0.60 142 402 423 F15 23.0 53.8 11.3 — 11.9 2.28 7.91 0.56 137 410 433 F16 14.3 28.2 32.4 15.1 10.0 2.45 8.14 0.67 146 426 460 F17 20.0 29.8 34.2 16.0 — 2.41 7.83 0.89 139 432 467 F18 21.4 31.4 36.1 — 11.1 2.39 7.65 0.90 137 423 452 F19 19.2 39.9 7.4 20.2 13.3 2.30 9.51 0.94 175 348 365 F20 27.5 42.8 8.0 21.7 — 2.28 9.11 0.89 165 348 365 F21 29.7 46.3 8.6 — 15.4 2.24 8.87 0.67 159 349 365

Property of Glass Frit

Physical and electrical properties of the glass frit can be known from the results of Table 1.

An extensive inspection on Li₂O—B₂O₃—SiO₂ three component system shows that a composition in the range of F01–F12 was evaluated to have a low glass transition temperature (Tg) and excellent electrical property.

In view of composition, SiO₂ was set in the range of 7–40 wt %, B₂O₃ was set in the range of 33–60 wt %, and Li₂O was set in the range of 18–41%.

As a whole, a density in the range of 2.2–2.5 was obtained and dielectric constant (k) was shown in the range of 6.4–8.5. A glass transition temperature (Tg) was shown in the range of 350° C.–510° C., and a dielectric loss (tan δ) was shown in the range of 0.3–1.0%.

In case of F13–F21, compositions in which a part of Li₂O is substituted with K₂O and Na₂O, it is noted that a dielectric loss value was somewhat increased but the glass transition temperature was substantially low.

A thermal expansion coefficient (TEC) was shown in the range of 100–170×10⁻⁶, which is more increased in case of the composition that a part of Li₂O is substituted with K₂O and Na₂O.

Mixture of Dielectric Powder and Glass Frit

A glass frit having such various types of composition as fabricated in the above method was mixed with a BaO—TiO₂ system dielectric composition (BaO-4TiO₂:BT4) in an addition range of 3–15 wt % as shown in Table 2.

The dielectric and glass frit was, respectively, wet-mixed together with a zirconia ball by using ethanol as a solvent for 24 hours.

In order to shape the mixed powder, 2 wt % of PVA (poly-vinyl alcohol) aqueous solution was added as a binding agent and agglomerated through sieving (100 mesh). The finally obtained composite material was unixially pressurized in a mold with a diameter of 10 mm under the pressure of 1,000 kg/cm³, in order to make it in a cylindrical shape.

The shaped test sample was heated at a rising temperature rate of 5° C./min, sintered at a temperature of 800–950° C., and then furnace-cooled. Table 2 shows sintering and electric properties of the thusly obtained test sample.

TABLE 2 Ceramic Glass composition composition Firing Relative Dielectric Quality Content Content temperature density constant factor τ_(f) No. Type (wt %) Type (wt %) (° C.) (%) (k) (GHz) (ppm/° C.) D01 BT4 95 F01 5 925 98.82 34.7 11200 +19 D02 BT4 93 7 875 99.78 33.8 12700 +25 D03 BT4 90 10 875 99.45 31.2 9600 +15 D04 BT4 95 F05 5 950 96.73 32.4 11700 +10.6 D05 BT4 93 7 925 97.68 31.4 9500 +31.5 D06 BT4 90 10 900 98.88 30.1 9200 +30.8 D07 BT4 97 F06 3 950 98.71 36.6 20600 +10 D08 BT4 95 5 925 98.31 34.5 13200 +29 D09 BT4 93 7 900 99.01 33.3 9900 +26 D10 BT4 90 10 875 98.22 31.7 9000 +11 D11 BT4 87 13 875 96.16 27.9 7000 +5 D12 BT4 84 16 875 99.17 27.0 6100 +2 D13 BT4 95 F08 5 925 98.66 34.5 11300 +11 D14 BT4 93 7 900 98.01 32.5 9900 +17 D15 BT4 90 10 875 99.24 30.6 6500 +24 D16 BT4 95 F09 5 950 95.07 32.3 12200 +8 D17 BT4 93 7 875 92.91 29.5 9400 +22 D18 BT4 90 10 875 94.40 29.0 6200 +25 D19 BT4 95 F10 5 925 98.05 32.8 18600 +18 D20 BT4 93 7 925 99.99 32.7 16900 +24 D21 BT4 90 10 925 99.99 30.4 11900 +21 D22 BT4 95 F13 5 925 99.99 36.6 11600 +29 D23 BT4 93 7 900 99.99 34.4 15000 +22 D24 BT4 90 10 875 99.99 30.9 11600 +18 D25 BT4 95 F14 5 925 99.99 36.0 11000 +3 D26 BT4 93 7 900 99.99 33.2 13300 +7 D27 BT4 90 10 875 98.24 29.2 10500 −11 D28 BT4 95 F16 5 925 99.99 36.6 11800 +34 D29 BT4 93 7 900 99.99 34.2 9600 +19 D30 BT4 90 10 875 99.81 30.2 9500 +3

Characteristics of Dielectric/glass Frit Mixture

Table 2 shows a density and an electrical property of the test sample which was obtained by adding 3–14 wt % of various types of glass frits to the BaO-4TiO₂ (BaTi₄O₉) composition and sintering it at the temperature of 850–950° C.

On the whole, an excellent low-temperature sintering property is shown having a relative density of above 99% at a temperature of below 900° C. Especially, F01, F08, F13 and F16 shows a density of above 99% at a temperature of 875° C. when 10% of frit is added.

Observation through a scanning electron microscope confirms that a dense structure without an air pore was obtained.

Substantially, a dielectric constant was shown in the range of 25–37, and a quality factor was about 5,000–20,000 GHz.

When conditions are limited to a density of above 99% at a firing temperature of below 875° C. most suitable for co-firing together with Ag electrode, when glass frits such as F08, F13 or the like was added in the range of 7–10 wt %, a quality factor was obtained by above 10,000 and a dielectric constant was obtained by more than 30.

Inspection on the BaO-4.5TiO₂ (Ba₂Ti₉O₂₀) composition shows that it also has the similar low temperature sintering property and electrical property when the glass frit was added thereto.

Those composition as described above are suitable for use as a material for ceramic multi-layer package in the type of resonator co-filed with Ag electrode.

Comprehensively speaking on the basis of Table 1 and Table 2, it is noted that, for Li₂O—B₂O₃—SiO₂ system, the case of substitution of Li₂O with K₂O and Na₂O shows a better low-temperature sintering property while its quality factor was a bit degraded.

Results on Another Type of Dielectric Composition

Besides the BaO-nTiO₂ (n=4–4.5) composition primarily discussed in the present invention, Table 3 shows results of different types of compositions, that is, (Ba,Pb)O—Nd₂O₃—TiO₂ (BPNT) composition and BaO—(Bi,Nd)₂O₃—TiO₂ (BBNT) composition. When F08 and F16 frits was applied, a composition having a density of above 98% at a temperature of 875° C. was obtained. In such a case, its dielectric constant was 40–65 and a quality factor was 1,000–3,000.

TABLE 3 Ceramic Glass composition composition Firing Relative Dielectric Quality Content Content temperature density constant factor τ_(f) No. Type (wt %) Type (wt %) (° C.) (%) (k) (GHz) (ppm/° C.) E01 BPNT 85 F01 15 875 97.32 51.1 2700 +23 E02 BPNT 85 F04 15 875 97.88 50.5 2500 +17 E03 BPNT 80 20 875 97.05 39.4 2500 +19 E04 BPNT 85 F08 15 875 99.17 50.8 2700 +33 E05 BPNT 80 20 875 99.99 43.3 2600 +11 E06 BPNT 85 F14 15 875 90.68 40.6 850 +17 E07 BPNT 80 20 875 94.43 34.8 2400 +17 E08 BBNT 93 F16 7 850 94.18 59.3 1500 −17 E09 BBNT 93 7 875 98.21 64.3 2700 +26 E10 BBNT 93 7 900 99.47 66.4 2700 +37 E11 BBNT 90 10 825 95.96 52.1 1900 +6 E12 BBNT 90 10 850 97.46 53.3 2400 +15 E13 BBNT 90 10 875 98.41 55.3 2500 +21 E14 BBNT 90 10 900 99.59 56.7 2700 +31 E15 BBNT 87 13 825 95.25 44.5 1300 −17 E16 BBNT 87 13 850 95.52 45.2 2400 +20 E17 BBNT 87 13 875 96.78 46.3 2400 +4 E18 BBNT 87 13 900 97.98 47.0 2600 +24

As so far described, by mixing 3–16 wt % of K₂O—Na₂O—Li₂O—B₂O₃—SiO₂ system glass frit and 84–97 wt % of BaO—TiO₂ system dielectric ceramics, a dielectric composition was obtained which can be fired at a temperature of below 875° C.

The dielectric composition has a dielectric constant of 25–35 and a quality factor (Qxf) of 6,000–20,000 GHz.

The composition according to the present invention can be effectively applied to construct a part of a ceramic multi-layer packaging as a resonator form such as a filter or an antenna, etc.

Especially, the composition of the present invention can be fired at a temperature of below 875° C., considerably low than the melting temperature of Ag electrode, 950° C., for less than 2 hours. Thus, during the firing process, a diffuse reaction of the Ag electrode is restrained so that reactivity with the electrode can be minimized. 

1. A dielectric composition comprising: 84–97 wt % of BaO—(Bi,Nd)₂O₃—TiO₂; and 3–16 wt % of glass flit containing Li₂O, B₂O₃ and SiO₂, wherein the glass frit comprises: 7–40 wt % of SiO₂, 33–60 wt % of B₂O₃, and 18–41 wt % of Li₂O.
 2. The composition of claim 1, wherein Li₂O is substituted by 0–50% with K₂O and Na₂O in each weight ratio.
 3. The composition of claim 1, wherein the glass frit has a dielectric constant of 6.4–8.5, a glass transition temperature of 350–510° C. and a dielectric loss value of 0.3–1.0%.
 4. The composition of claim 2, wherein the glass frit has a dielectric constant of 6.4–8.5, a glass transition temperature of 350–510° C. and a dielectric loss value of 0.3–1.0%.
 5. The composition of claim 1, which has a density of above 99% at a temperature of below 875° C., a dielectric constant of 25–35, and a quality factor (Qxf) of 6,000–20,000. 